John C. Bravman: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

Don't use scam websites

1

The evolution of the resistance of aluminum interconnects during electromigration

Jonathan C. Doan, John C. Bravman, Paul A. Flinn, Thomas N. Marieb

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 577 KB

english, 2000

2

Adhesion Mechanisms of Silane Adhesion Promoters in Microelectronic Packaging

Jenkins, Maura, Snodgrass, Jeffrey, Chesterman, Aaron, DeVries, Gretchen, Dauskardt, Reinhold H., Bravman, John C.

Journal:

MRS Proceedings

Year:

2001

Language:

english

File:

PDF, 32 KB

english, 2001

3

Descriptive Epidemiology of the MOON Shoulder Instability Cohort

Kraeutler, Matthew J., McCarty, Eric C., Belk, John W., Wolf, Brian R., Hettrich, Carolyn M., Ortiz, Shannon F., Bravman, Jonathan T., Baumgarten, Keith M., Bishop, Julie Y., Bollier, Matthew J., Brop

Journal:

American Journal of Sports Medicine

Year:

2018

Language:

english

File:

PDF, 312 KB

english, 2018

4

The preparation of cross-section specimens for transmission electron microscopy

John C. Bravman, Robert Sinclair

Journal:

Microscopy Research and Technique

Year:

1984

Language:

english

File:

PDF, 1.76 MB

english, 1984

5

Pseudo-quaternary phase relations near Bi2Sr2CaCu2O8+x in reduced oxygen pressures

Judith L. MacManus-Driscoll, John C. Bravman, Robert B. Beyers

Journal:

Physica C: Superconductivity

Year:

1995

Language:

english

File:

PDF, 1.10 MB

english, 1995

6

Stress relaxation in free-standing aluminum beams

Hoo-Jeong Lee, Ping Zhang, John C. Bravman

Journal:

Thin Solid Films

Year:

2005

Language:

english

File:

PDF, 573 KB

english, 2005

7

Effects of Silver and Lead on the Phase Stability of Bi2Sr2Ca1Cu2O8+x and Bi2Sr2Ca2Cu3O10+x above and below the Solidus Temperature

Judith L. MacManus-Driscoll, John C. Bravman, Richard J. Savoy, Grace Gorman, Robert B. Beyers

Journal:

Journal of the American Ceramic Society

Year:

1994

Language:

english

File:

PDF, 951 KB

english, 1994

8

Mechanical properties and microstructural characterization of Al-0.5%Cu thin films

Ramnath Venkatraman, John C. Bravman, W. D. Nix, Paul W. D Avies, Paul A. Flinn, David B. Fraser

Journal:

Journal of Electronic Materials

Year:

1990

Language:

english

File:

PDF, 2.36 MB

english, 1990

9

Tensile failure by grain thinning in micromachined aluminum thin films

Lee, Hoo-Jeong, Zhang, Ping, Bravman, John C.

Journal:

Journal of Applied Physics

Year:

2003

Language:

english

File:

PDF, 1.40 MB

english, 2003

10

TRANSIENT DIFFUSION OF BERYLLIUM AND SILICON IN GALLIUM ARSENIDE

Haddara, Yaser M., Bravman, John C.

Journal:

Annual Review of Materials Science

Year:

1998

Language:

english

File:

PDF, 314 KB

english, 1998

11

An analysis technique for extraction of thin film stresses from x-ray data

Cornella, Guido, Lee, Seok-Hee, Nix, William D., Bravman, John C.

Journal:

Applied Physics Letters

Year:

1997

Language:

english

File:

PDF, 303 KB

english, 1997

12

Stress-induced and electromigration voiding in aluminum interconnects passivated with silicon nitride

Lee, Seok-Hee, Bravman, John C., Doan, Jonathan C., Lee, Samantha, Flinn, Paul A., Marieb, Thomas N.

Journal:

Journal of Applied Physics

Year:

2002

Language:

english

File:

PDF, 775 KB

english, 2002

13

Stress relaxation of free-standing aluminum beams for microelectromechanical systems applications

Lee, Hoo-Jeong, Cornella, Guido, Bravman, John C.

Journal:

Applied Physics Letters

Year:

2000

Language:

english

File:

PDF, 397 KB

english, 2000

14

Structure and morphology of polycrystalline silicon-single crystal silicon interfaces

Bravman, John C., Patton, Gary L., Plummer, James D.

Journal:

Journal of Applied Physics

Year:

1985

Language:

english

File:

PDF, 633 KB

english, 1985

15

Diffusion of implanted Be in AlxGa1−xAs as a function of Al concentration and anneal temperature

Lee, Cynthia C., Deal, Michael D., Bravman, John C.

Journal:

Applied Physics Letters

Year:

1995

Language:

english

File:

PDF, 319 KB

english, 1995

16

Phase equilibria and melt processing of Bi2Sr2Ca1Cu2O8+x tapes at reduced oxygen partial pressures

MacManus-Driscoll, Judith L., Wang, Pin-Chin, Bravman, John C., Beyers, Robert B.

Journal:

Applied Physics Letters

Year:

1994

Language:

english

File:

PDF, 480 KB

english, 1994

17

Effect of encapsulant material on the diffusion of beryllium in molecular beam epitaxy gallium arsenide

Haddara, Yaser M., Deal, Michael D., Bravman, John C.

Journal:

Applied Physics Letters

Year:

1996

Language:

english

File:

PDF, 321 KB

english, 1996

18

Separation of film thickness and grain boundary strengthening effects in Al thin films on Si

Venkatraman, Ramnath, Bravman, John C.

Journal:

Journal of Materials Research

Year:

1992

Language:

english

File:

PDF, 2.48 MB

english, 1992

19

Measurement and interpretation of strain relaxation in passivated Al–0.5% Cu lines

Besser, Paul R., Marieb, Thomas N., Lee, Jin, Flinn, Paul A., Bravman, John C.

Journal:

Journal of Materials Research

Year:

1996

Language:

english

File:

PDF, 496 KB

english, 1996

20

An x-ray method for direct determination of the strain state and strain relaxation in micron-scale passivated metallization lines during thermal cycling

Besser, Paul R., Brennan, Sean, Bravman, John C.

Journal:

Journal of Materials Research

Year:

1994

Language:

english

File:

PDF, 1.11 MB

english, 1994

21

Mechanical Behavior of Thin Films

Bravman, John C., Nix, William D.

Journal:

Year:

1992

Language:

english

File:

PDF, 3.43 MB

english, 1992

22

Elastic strain gradients and x-ray line broadening effects as a function of temperature in aluminum thin films on silicon

Venkatraman, Ramnath, Besser, Paul R., Bravman, John C., Brennan, Sean

Journal:

Journal of Materials Research

Year:

1994

Language:

english

File:

PDF, 803 KB

english, 1994

23

Effect of Interface Conditions on Yield Behavior of Passivated Copper Thin Films

Vinci, Richard P., Forrest, Stefanie A., Bravman, John C.

Journal:

Journal of Materials Research

Year:

2002

Language:

english

File:

PDF, 140 KB

english, 2002

24

Mechanical Behavior of Single Crystal A1 (111) and Bicrystal Al (110) Films on Silicon Substrates

Besser, Paul R., Sanchez, John E., Brennan, S., Bravman, John C., Takaoka, G., Yamada, I.

Journal:

MRS Proceedings

Year:

1994

Language:

english

File:

PDF, 363 KB

english, 1994

25

Calculation of Stress Gradients in Thin Al-0.5%Cu/Ti Lines from Strain Gradients Measured as a Function of Temperature Using Grazing Incidence X-Ray Scattering

Besser, Paul, Venkatraman, Ramnath, Brennen, Sean, Bravman, John

Journal:

MRS Proceedings

Year:

1991

Language:

english

File:

PDF, 353 KB

english, 1991

26

An Anodic Process for the Determination of Grain Boundary and Film Thickness Strengthening Effects in Aluminum Films on Oxidized Silicon.

Venkatraman, Ramnath, Bravman, John C.

Journal:

MRS Proceedings

Year:

1991

Language:

english

File:

PDF, 451 KB

english, 1991

27

Determination of Strain Distributions in Aluminum Thin Films as a Function of Temperature by the use of Synchrotron Grazing Incidence X-Ray Scattering

Venkatraman, Ramnath, Besser, Paul R., Brennan, Sean, Bravman, John C.

Journal:

MRS Proceedings

Year:

1991

Language:

english

File:

PDF, 383 KB

english, 1991

28

Stress in Copper thin Films With Barrier Layers

Vinci, Richard P., Bravman, John C.

Journal:

MRS Proceedings

Year:

1993

Language:

english

File:

PDF, 324 KB

english, 1993

29

Stress in Copper Thin Films with Barrier Layers

Vinci, Richard P., Bravman, John C.

Journal:

MRS Proceedings

Year:

1993

Language:

english

File:

PDF, 316 KB

english, 1993

30

Strain Relaxation and In-Situ Observation of Voiding in Passivated Aluminum alloy Lines

Besser, Paul R., Marieb, Thomas N., Bravman, John C.

Journal:

MRS Proceedings

Year:

1993

Language:

english

File:

PDF, 1.17 MB

english, 1993

31

Stress Gradient and Relaxation Measurements in AL and Oxygen-Implanted AL Films.

Besser, Paul R., Bader, Stefan, Venkatraman, Ramnath, Bravman, John C.

Journal:

MRS Proceedings

Year:

1993

Language:

english

File:

PDF, 444 KB

english, 1993

32

Non-Destructive Evaluation of Strains and Voiding in Passivated copper Metallizations

Vinci, Richard P., Marieb, Thomas N., Bravman, John C.

Journal:

MRS Proceedings

Year:

1993

Language:

english

File:

PDF, 1.17 MB

english, 1993

33

Non-Destructive Evaluation of Strains and Voiding in Passgvated Copper Metallizations

Vinci, Richard P., Marieb, Thomas N., Bravman, John C.

Journal:

MRS Proceedings

Year:

1993

Language:

english

File:

PDF, 1.25 MB

english, 1993

34

Strain Relaxation and In-Situ Observation of Voiding in Passivated Aluminum Alloy Lines.

Besser, Paul R., Marieb, Thomas N., Bravman, John C.

Journal:

MRS Proceedings

Year:

1993

Language:

english

File:

PDF, 1.12 MB

english, 1993

35

Stress Gradient and Relaxation Measurements in Al and Oxygen-Implanted al Films.

Besser, Paul R., Bader, Stefan, Venkatraman, Ramnath, Bravman, John C.

Journal:

MRS Proceedings

Year:

1993

Language:

english

File:

PDF, 461 KB

english, 1993

36

Measurement and Interpretation of Strain Relaxation in Passivated Al-0.5%Cu Lines

Besser, Paul R., Marieb, Thomas N., Bravman, John C., Flinnt, Paul A.

Journal:

MRS Proceedings

Year:

1994

Language:

english

File:

PDF, 1.31 MB

english, 1994

37

Morphological Studies of Polysilicon Emitter Contacts

Bravman, John C., Patton, Gary L., Sinclair, Robert, Plummer, James D.

Journal:

MRS Proceedings

Year:

1984

Language:

english

File:

PDF, 3.98 MB

english, 1984

38

Stress and Microstructural Evolution of Lpcvd Polysilicon Thin Films During High Temperature Annealing

Yu, Chia-Liang, Flinn, Paul A., Lee, Seok-Hee, Bravman, John C.

Journal:

MRS Proceedings

Year:

1996

Language:

english

File:

PDF, 1.14 MB

english, 1996

39

In-situ Measurement of Viscous Flow of Thermal Silicon Dioxide Thin Films at High Temperature

Yu, Chia-Liang, Flinn, Paul A., Bravman, John C.

Journal:

MRS Proceedings

Year:

1996

Language:

english

File:

PDF, 333 KB

english, 1996

40

Observation of Electromigration Voiding in Cu Lines

Lee, Seok-Hee, Bravman, John C., Flinn, Paul A., Arnaud, Lucile

Journal:

MRS Proceedings

Year:

1997

Language:

english

File:

PDF, 2.08 MB

english, 1997

41

A Quantitative Study of Void Nucleation Times in Passivated Aluminum Interconnects

Doan, Jonathan C., Bravman, John C., Flinn, Paul A., Marieb, Thomas N.

Journal:

MRS Proceedings

Year:

1998

Language:

english

File:

PDF, 2.90 MB

english, 1998

42

The Effects of Passivation Thickness and Initial Aluminum Line Stress on Electromigration Behavior

Lee, Samantha, Bravman, John C., Flinn, Paul A., Marieb, Tom N.

Journal:

MRS Proceedings

Year:

1998

Language:

english

File:

PDF, 1.80 MB

english, 1998

43

Effect of Microstructure and Chemical Bonding on the Adhesion Strength of a Silicon/Polymer Interface for Microelectronic Packaging Applications

Pantelidis, Dimitrios, Lee, Hoo-Jeong, Bravman, John C.

Journal:

MRS Proceedings

Year:

1998

Language:

english

File:

PDF, 1.44 MB

english, 1998

44

A Detailed Study of Void Motion In Passivated Aluminum Interconnects

Doan, Jonathan C., Bravman, John C., Flinn, Paul A., Marieb, Thomas N.

Journal:

MRS Proceedings

Year:

1999

Language:

english

File:

PDF, 1.58 MB

english, 1999

45

Study of Crack Propagation at an Oxide/Polymer Interface Under Varying Loading Conditions

Panteliidis, Dtmitrios, Snodgrass, Jeffrey, Dauskardt, Reinhold H., Bravman, John C.

Journal:

MRS Proceedings

Year:

1999

Language:

english

File:

PDF, 421 KB

english, 1999

46

Atomic Force Microscopy Studies of Fracture Surfaces From Oxide / Polymer Interfaces

Jenkins, Maura, Snodgrass, Jeffrey, Chesterman, Aaron, Dauskardt, Reinhold H., Bravman, John C.

Journal:

MRS Proceedings

Year:

2000

Language:

english

File:

PDF, 209 KB

english, 2000

47

Studies of Silane Adhesion Promoters on Silica Filler Particles for use in Microelectronic Packaging

Jenkins, Maura, DeVries, Gretchen, Dauskardt, Reinhold H., Bravman, John C.

Journal:

MRS Proceedings

Year:

2001

Language:

english

File:

PDF, 214 KB

english, 2001

48

X-ray Determination and Finite-Element Modeling of Stress in Passivated Al-0.5%Cu Lines During Thermal Cycling.

Besser, Paul R., Mack, Anne Sauter, Fraser, David, Bravman, John C.

Journal:

MRS Proceedings

Year:

1993

Language:

english

File:

PDF, 416 KB

english, 1993

49

SPIE Proceedings [SPIE O-E/LASE'86 Symp (January 1986, Los Angeles) - Los Angeles, CA (Tuesday 21 January 1986)] Advanced Processing and Characterization of Semiconductors III - High Resolution Microstructural Studies Of Semiconductor Materials

Bravman, John C., Sadana, Devindra K., Current, Michael I.

Year:

1986

Language:

english

File:

PDF, 12.61 MB

english, 1986

50

Lesser tuberosity osteotomy and subscapularis tenotomy repair techniques during total shoulder arthroplasty: A meta-analysis of cadaveric studies

Schrock, John B., Kraeutler, Matthew J., Houck, Darby A., Provenzano, Gina G., McCarty, Eric C., Bravman, Jonathan T.

Journal:

Clinical Biomechanics

Year:

2016

Language:

english

File:

PDF, 212 KB

english, 2016